Recent Publications
Application of the protection/deprotection strategy to the science of porous materials
Adv. Mater., 2011, 23, 2828.
T. Frot, W. Volksen, S. Purushothaman, R. Bruce, G. Dubois.
A manufacturing grade, porous oxycarbosilane spin-on dielectric candidate with k ≤ 2.0
J. Electrochem. Soc., 2011, 158, G155.
W. Volksen, T.P. Magbitang, R.D. Miller, S. Purushothaman, S. Cohen, H. Nakagawa, Y. Nobe, T. Kokubo, G. Dubois.
Cryogenic plasmas for controlled processing of nanoporous materials
Phys. Chem. Chem. Phys., 2011, 13, 3634.
F. Iacopi, J.H. Choi, K. Terashima, P.M. Rice, G. Dubois.
Molecular origins of the mechanical behavior of hybrid glasses
Adv. Funct. Mat., 2010, 20, 2884.
M. Oliver, G. Dubois, R. Dauskardt.
Low Dielectric Materials
Chem. Rev., 2010, 110, 56
W. Volksen, R.D. Miller, G. Dubois.
Adjusting the skeleton and pore structure of porous SiCOH dielectrics
J. Electrochem. Soc., 2009, 156, G156.
S.M. Gates, G. Dubois, E.T. Ryan, A. Grill, M. Liu, D. Gidley.
Organic Thin Film Transistor Using a Photo-Curable Organic/Inorganic Hybrid Material as a Gate Dielectric
Journal of Nanoscience and Nanotechnology, 2008, 8, 4561.
Hwang D-H, Yang Y.S, Lee J-I, Kim S.H, Park O-H, Kim H-C, Lee V, Dubois G, Miller R.D.
Ultra low-k films derived from hyperbranched polycarbosilanes (HBPCS)
Adv. Funct. Mater., 2008, 18, 4022.
J.S. Rathore, L.V. Interrante, G. Dubois.
Laser Spike Annealing: A novel post-porosity treatment for toughening of low-k organosilicates
J. Electrochem. Soc., 2008, 155, G224.
W. Volksen, G. Dubois, A. Kellock, T. Magbitang, R. Miller, D. Miller, S. Cohen, E. Simonyi, L. Ramirez, Y. Wang, D. Markle.
Superior mechanical properties of dense and porous organic/inorganic hybrid thin films
Journal of Sol-gel Science and Technology, 2008, 48, 187
G. Dubois, W. Volksen, T. Magbitang, M. Sherwood, R.D. Miller, David. M. Gage, R.H. Dauskardt.
Molecular Controlled Fracture and Release of Templated Nanoporous Organosilicate Thin Films
Adv. Mater., 2008, 20, 3159.
M.D. Ong, W. Volksen, G. Dubois, V. Lee, P.J. Brock, V.R. Deline, R.D. Miller, R. H. Dauskardt.
Molecular network reinforcement of sol-gel glasses.
Adv. Mater. 2007, 19, 3898.
G. Dubois, W. Volksen, T. Magbitang, R.D. Miller, D.M. Gage, R.H. Dauskardt.
Recent Presentations
Future of PECVD and Spin-On Ultra Low-k Materials
G. Dubois, W. Volksen, T.J. Frot, T.P. Magbitang, S.M. Gates, R. Dauskardt and M. Oliver
IITC, Dresden, Germany, May 2011 (invited)
Post Porosity Protection: a new ULK friendly integration approach
Molecularly Reinforced Sol-Gel Glasses with Improved Pore Size Distribution
Post-Porosity Plasma Protection, a new approach to integrate k = 2.2 porous ULK materials
Future of PECVD and Spin-on Low-k Materials
Challenges in sub-100 nm Dual Damascene Etch of Porous Oxycarbosilane Ultra Low-k Dielectrics for BEOL Integration
Chip-Package Interactions from Low-k Materials Perspective
Molecularly Reinforced Sol-Gel Glasses: Preparation, Characterization and Integration Studies
Factors Governing the Mechanical Properties of Porous Sol-Gel Spin-On Thin Films
Molecular Network Reinforcement of Sol-Gel Glasses
Molecular Network Reinforcement of Sol-Gel Glasses
Molecular Network Reinforcement of Sol-Gel Glasses
Superior Mechanical Properties of Dense and Porous Organic/Inorganic Hybrid Thin Films
Superior Mechanical Properties of Dense and Porous Organic/Inorganic Hybrid Thin Films
Effect of Environment on the Modulus of Low-k Porous ILD Films used in the BEOL
T.J. Frot, T.P. Magbitang, G Dubois, S. Purushothaman, R.L. Bruce and W. Volksen
W. Volksen, G. Dubois, T. Magbitang, T. Frot, P Rice, L. Krupp, S. Purushothaman, R. Bruce, S. Cohen, M. Lofaro, S.U. Engelmann, H. Nakagawa, M. Sekiguchi, T. Kokubo
MRS Spring National Meeting, San Francisco, CA, April 2011
G. Dubois, T.J. Frot, W. Volksen, T.P. Magbitang, D.C. Miller, S. Purushothaman, R.L. Bruce and M. Lofaro
IITC, Dresden, Germany, May 2011
G. Dubois
ADMETA JAPAN 2010, Tokyo, Japan, Oct. 2010 (invited)
R.L. Bruce, S.U. Engelmann, S. Purushothaman, M. Darnon, M.F. Lofaro, S.A. Cohen, W. Volksen, T.J. Frot, T.P. Magbitang, P.M. Rice, L.E. Krupp, G. Dubois
AVS-57th Int. Symposium, Albuquerque, N.M., Oct. 2010
G. Dubois
Int. Conf. on Electronic Packaging, Sapporo, Japan, May 2010 (invited)
W. Volksen, R. D. Miller , T. Magbitang, V. Lee, P. Rice, G. Dubois, J. Doyle, N. Fuller, S. Engelmann, M. Darnon, M. Lofaro; S. Cohen, M. Sankarapandian, S. Purushothaman, H. Nakagawa; Y. Nobe and T. Kokubo
MRS Spring National Meeting, San Francisco, CA, April 2010 (invited)
G. Dubois, W. Volksen, T.P. Magbitang, M.H. Sherwood, R.D. Miller, D. Gage and R. Dauskardt
15th Int. Sol-Gel Conference, Brazil, August 2009.
G. Dubois, W. Volksen, T.P. Magbitang, R.D. Miller, D. Gage, R. Dauskardt
MRS Spring National Meeting, San Francisco, CA, March 2008
G. Dubois, W. Volksen, T.P. Magbitang, R.D. Miller, D. Gage, R. Dauskardt
MARM-ACS, New York, N. Y., May 2008 (invited)
G. Dubois, W. Volksen, R.D. Miller, T.P. Magbitang, D. Gage, R. Dauskardt
14th Int. Sol-Gel Conference, Montpellier, France, Sept. 2007
G. Dubois, W. Volksen, R.D. Miller, T.P. Magbitang, D. Gage, R. Dauskardt
VMIC 2007, Fremont, CA, Sept. 2007 (invited)
E. E. Simonyi, C.D. Dimitrakopoulos, S.M. Gates, M. Lane, E. Liniger, W. Volksen
MRS Spring National Meeting, San Francisco, CA, April 2007
Book Chapters
"Spin-On Dielectric Materials", Dielectric Films for Advanced Microelectronics, K .Maex, M. R. Baklanov, M. Green (Editors), John Wiley & Sons, 2007.
Geraud Dubois, Robert D. Miller, Willi Volksen.
"Microelectronic Materials with Hierarchical Organization", Macromolecular Engineering: From precise Macromolecular Synthesis to Macroscopic Materials Properties and Applications, Eds. K. Matyjaszewski, Y. Gnanou, L. Leibler, VCH, 2007.
G. Dubois, R.D. Miller, J.L. Hedrick
"Nanostructured Silica and Silica-Derived Materials", Dekker Encyclopedia of Nanoscience and Nanotechnology, 2005.
H.C. Kim, G. Dubois.
"Porous Organosilicates for On-Chip Applications: Dielectric Generational Extendibility by the Introduction of Porosity", Springer Series in Advanced Microelectronics, Vol. 9 :Low Dielectric Constant Materials for IC Applications, P. Ho, J. Leu, W.W. Lee (Editors), Springer Verlag, 2003.
W. Volksen, R. D. Miller, J. L. Hedrick, C. J. Hawker, V. Y. Lee, T. P. Magbitang, M. F. Toney, K. Lynn, M. Weber, M. Petkov, P. Ho, M. Kiene, J. Liu, K. P. Rodbell, E. Huang.
Recent Patents
US 7,960,442 (06/14/2011)
Nanoporous media template from unsymmetrical amphiphilic porogens.
Cha, Jennifer; Dubois, Geraud; Hedrick, James Lupton; Kim, Ho-Cheol; Lee, Victor; Miller, Robert Dennis, Volksen, Willi.
US 7,931,829 (04/26/2011)
Low-k interlevel dielectric materials and method of forming low-k interlevel dielectric layers and structures.
Dubois, Geraud; Hedrick, James Lupton; Kim, Ho-Cheol; Lee, Victor; Magbitang, Teddie; Miller, Robert Dennis; Sankarapandian, Muthumanickam; Sundberg, Linda; Volksen, Willi.
US 7,927,664 (04/19/2011)
Method of step-and-flash imprint lithography.
DiPietro, Richard Anthony; Dubois, Geraud; Miller, Robert Dennis; Sooriyakumaran, Ratnam.
US 7,919,225 (04/05/2011)
Photopatternable dielectric materials for BEOL applications.
Allen, Robert David; Brock, Phillip; Davis, Blake; Dubois, Geraud; Qinghuang, Lin; Miller, Robert Dennis; Purushothaman, Sampath; Sooriyakumaran, Ratnam.
US 7,892,635 (02/22/2011)
Precursors for porous low-k dielectric constant materials for use in electronic devices.
Hawker, Craig Jon; Hedrick, James Lupton; Miller, Robert Dennis; Volksen, Willi.
US 7,820,242 (10/26/2010)
Low-k interlevel dielectric materials and method of forming low-k interlevel dielectric layers and structures.
Dubois, Geraud; Hedrick, James Lupton; Kim, Ho-Cheol; Lee, Victor; Magbitang, Teddie; Miller, Robert Dennis; Sankarapandian, Muthumanickam; Sundberg, Linda; Volksen, Willi.
US 7,482,389 (01/27/2009)
Nanoporous media with lamellar structures.
Cha, Jennifer; Dubois, Geraud; Hedrick, James Lupton; Kim, Ho-Cheol; Lee, Victor; Magbitang, Teddie; Miller, Robert Dennis; Volksen, Willi.
US 7,468,330 (12/23/2008)
US 7,368,483 (05/06/2008)
US 7,341,788 (03/11/2008)
US 7,309,754 (12/18/2007)
US 7,229,934 (06/12/2007)
Imprint process using polyhedral oligmeric silsesquioxane based imprint materials.
Method of forming low-k interlevel dielectric layers and structures.
Dubois, Geraud; Hedrick, James Lupton; Kim, Ho-Cheol; Lee, Victor; Magbitang, Teddie; Miller, Robert Dennis; Sankarapandian, Muthumanickam; Sundberg, Linda; W. Volksen, Willi.
Porous composition of matter, and method of making same.
Connor, Eric; Godschalx, James P.; Hawker, Craig Jon; Hedrick, James Lupton; Lee, Victor; Magbitang, Teddie; Miller, Robert Dennis; Volksen, Willi.
Materials having predefined morphologies and methods of formation thereof.
Cha, Jennifer, Hedrick, James Lupton; Kim, Ho-Cheol; Miller, Robert Dennis; Volksen, Willi.
Stable encapsulant fluid capable of undergoing reversible Diels-Alder polymerization.
Brock, Phillip; M.W. Chaw, Dawson, Daniel; Hawker, Craig Jon; Hedrick, James Lupton; Magbitang, Teddie; McKean, Dennis; Miller, Robert Dennis; Palmisano, Richard; Volksen, Willi.
Porous organosilicates with improved mechanical properties.
Dubois, Geraud Jean-Michel; Hedrick, James Lupton; Kim, Ho-Cheol; Lee, Victor Yee-Way; Magbitang, Teddie Peregrino; Miller, Robert Dennis; Simonyi, Eva E.; Volksen, Willi.
