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Rutherford Backscattering Spectrometry (RBS)

Energy spectrometry using MeV He+ ions. The incident He+ ions are elastically scattered by nuclei of the analytical sample, providing a quantitative elemental depth profile. Multi-component, multi-layered samples can be analyzed to a depth of 1mm or more.

RBS has the following characteristics:

  • Multi-element depth concentration profiles
  • Fast, non-destructive analysis (no sample preparation or sputtering required)
  • Matrix independent (unaffected by chemical bonding states)
  • Quantitative without standards
  • High precision (typically ±3%)
  • High sensitivity (e.g. 1011 Au/cm2 on Si, depends on Z and sample composition)
  • Depth range typ. 0 - 1mm
  • Depth resolution ~20Å typ. near surface
  • Spatial definition :
    • - beam spot size 0.5-2.0 mm
    • - map or raster option to 7cm x 7cm

Typical Applications

  • Absolute thickness of films, coatings and surface layers (in atoms/cm2)
  • Surface/interface contaminant detection (oxide layers, adsorbates, etc)
  • Interdiffusion kinetics of thin films (metals, silicides, etc)
  • Elemental composition of complex materials (phase identification, alloy films, oxides, ceramics, glassy carbon, etc)
  • Quantitative dopant profiles in semiconductors
  • Process control monitoring - composition, contaminant control

sample RBS data

Typical example of RBS analysis: A 1000Å thick film of TiN on a Si substrate. The figure shows a background subtraction of the Si substrate to reveal the N peak. The ratio of the Ti and N peak areas gives the atomic concentration and the sum of the peak areas is the film thickness.






  

Techniques
Auger Electron Spectroscopy

Field Emission Transmission Electron Microscopy

Focussed Ion Beam (FIB)

Ion Beam Surface Analysis

Nuclear Magnetic Resonance (NMR) analysis

Scanning Electron Microscopy (SEM)

Scanning Probe Laboratory

Secondary Ion Mass Spectroscopy (SIMS)

Specular X-ray Reflectivity

Thermal Analysis

X-ray Diffraction

X-ray Photoelectron Spectroscopy (XPS)


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